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 MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
Hex D Flip-Flop with Common Clock and Reset with LSTTL Compatible Inputs
High-Performance Silicon-Gate CMOS
The MC74HCT174A is identical in pinout to the LS174. This device may be used as a level converter for interfacing TTL or NMOS outputs to High Speed CMOS inputs. This device consists of six D flip-flops with common Clock and Reset inputs. Each flip-flop is loaded with a low-to-high transition of the Clock input. Reset is asynchronous and active-low. * * * * * * Output Drive Capability: 10 LSTTL Loads TTL NMOS Compatible Input Levels Outputs Directly Interface to CMOS, NMOS and TTL Operating Voltage Range: 4.5 to 5.5 V Low Input Current: 1.0 A In Compliance with the Requirements Defined by JEDEC Standard No. 7A * Chip Complexity: 178 FETs or 44.5 Equivalent Gates LOGIC DIAGRAM
D0 3 D1 4 DATA INPUTS D2 6 D3 11 D4 13 14 D5 2 Q0 5 Q1 7 Q2 10 Q3 12 Q4 15 Q5
MC74HCT174A
N SUFFIX PLASTIC PACKAGE CASE 648-08
1
16
16 1
D SUFFIX SOIC PACKAGE CASE 751B-05
ORDERING INFORMATION MC74HCXXXAN MC74HCXXXAD Plastic SOIC
PIN ASSIGNMENT
RESET Q0 D0 D1 Q1 1 2 3 4 5 6 7 8 16 15 14 13 12 11 10 9 VCC Q5 D5 D4 Q4 D3 Q3 CLOCK
NONINVERTING OUTPUTS
D2 Q2 GND
CLOCK 9 PIN 16 = VCC PIN 8 = GND Reset L H H H H
FUNCTION TABLE
Inputs Clock X D X H L X X Output Q L H L No Change No Change
RESET 1
10/95
(c) Motorola, Inc. 1995
IIIIIIIIIIIII II IIIIIIIIIIIII II III I I IIIIIIIIIIIII I IIIIIIIIIIIII II III I II IIIIIIIIIIIII II IIIIIIIIIIIII II IIIIIIIIIIIII II IIIIIIIIIIIII II IIIIIIIIIIIII II IIIIIIIIIIIII II IIIIIIIIIIIII II IIIIIIIIIIIII II IIIIIIIIIIIII II IIIIIIIIIIIII IIIIIIIIIII I IIIIIIIIIIIII II IIIIIIIIIIIII II IIIIIIIIIIIII IIIIIIIIIII I IIIIIIIIIIIII II IIIIIIIIIIIII II IIIIIIIIIIIII II
Design Criteria Value 44.5 1.5 Units ea. ns Internal Gate Count* Internal Gate Propagation Delay Internal Gate Power Dissipation Speed Power Product 0.005 W pJ 0.0075 * Equivalent to a two-input NAND gate. 1
REV 6
L
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I III I I II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II I I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I I III I I I I I I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I I III I I I I I I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I I III I I I I I I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I III I I I IIIIIIIIIIIIIIIIIIIIIII I III I I I I IIIIIIIIIIIIIIIIIIIIIII I I IIIIIIIIIIIIIIIIIIIIIII III I III I I III I IIIIIIIIIIIIIIIIIIIIIII III I IIIIIIIIIIIIIIIIIIIIIII III I IIIIIIIIIIIIIIIIIIIIIII III I IIIIIIIIIIIIIIIIIIIIIII III I IIIIIIIIIIIIIIIIIIIIIII III I IIIIIIIIIIIIIIIIIIIIIII III I IIIIIIIIIIIIIIIIIIIIIII III I IIIIIIIIIIIIIIIIIIIIIII III I IIIIIIIIIIIIIIIIIIIIIII III I IIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIII II I IIIIIIIIIIIIIIIIIIIIIII III I IIIIIIIIIIIIIIIIIIIIIII III I IIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIII II I IIIIIIIIIIIIIIIIIIIIIII III I IIIIIIIIIIIIIIIIIIIIIII III I
* Maximum Ratings are those values beyond which damage to the device may occur. Functional operation should be restricted to the Recommended Operating Conditions. Derating -- Plastic DIP: - 10 mW/_C from 65_ to 125_C SOIC Package: - 7 mW/_C from 65_ to 125_C For high frequency or heavy load considerations, see Chapter 2 of the Motorola High-Speed CMOS Data Book (DL129/D). NOTE: Information on typical parametric values can be found in Chapter 2 of the Motorola High-Speed CMOS Data Book (DL129/D).
IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I III I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I III I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIII I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I IIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIII I IIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIII I I IIIIIIIIIIIIIIIIIIIIIII III IIIIIIIIIIIIIIIIIIIIIII I I IIIIIIIIIIIIIIIIIIIIIII
MAXIMUM RATINGS*
MOTOROLA
DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND)
RECOMMENDED OPERATING CONDITIONS
MC74HCT174A
Symbol
Vin, Vout
Symbol
Symbol
VCC
Vout
Tstg
ICC
Iout
VCC
Vin
PD
ICC
TL
VOH
tr, tf
Iin
VOL
ICC
TA
VIH
VIL
Iin
Lead Temperature, 1 mm from Case for 10 Seconds (Plastic DIP or SOIC Package)
Storage Temperature
Power Dissipation in Still Air
DC Supply Current, VCC and GND Pins
DC Output Current, per Pin
DC Input Current, per Pin
DC Output Voltage (Referenced to GND)
DC Input Voltage (Referenced to GND)
DC Supply Voltage (Referenced to GND)
Input Rise and Fall Time (Figure 1)
Operating Temperature, All Package Types
DC Input Voltage, Output Voltage (Referenced to GND)
DC Supply Voltage (Referenced to GND)
Additional Quiescent Supply Current
Maximum Quiescent Supply Current (per Package)
Maximum Input Leakage Current
Maximum Low-Level Output Voltage
Minimum High-Level Output Voltage
Maximum Low-Level Input Voltage
Minimum High-Level Input Voltage
Parameter
Parameter
Parameter
Plastic DIP SOIC Package
Vin = 2.4 V, Any One Input Vin = VCC or GND, Other Inputs lout = 0 A
Vin = VCC or GND Iout = 0 A
Vin = VIH or VIL |Iout| 4.0 mA
Vin = VIH or VIL |Iout| 20 A
Vin = VIH or VIL |Iout| 4.0 mA
Vin = VIH or VIL |Iout| 20 A
Vin = VCC or GND
Vout = 0.1 or VCC - 0.1 V |Iout| 20 A
Vout = 0.1 or VCC - 0.1 V |Iout| 20 A
v
v
v
v
v
v
Test Conditions
- 0.5 to VCC + 0.5
- 1.5 to VCC + 1.5
- 65 to + 150
- 0.5 to + 7.0
2 - 55 Min 4.5 Value 0 0 50 25 20 260 750 500 + 125 VCC Max 500 5.5 VCC V 5.5 5.5 5.5 4.5 4.5 5.5 4.5 4.5 5.5 4.5 5.5 4.5 5.5 Unit Unit mW mA mA mA
_C
_C
_C
ns
V
V
V
V
V
- 55 to 25_C
0.1
0.26
3.98
4.0
0.1 0.1
4.4 5.4
0.8 0.8
2.0 2.0
- 55_C
2.9
This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high-impedance circuit. For proper operation, Vin and Vout should be constrained to the range GND (Vin or Vout) VCC. Unused inputs must always be tied to an appropriate logic voltage level (e.g., either GND or VCC). Unused outputs must be left open.
Guaranteed Limit
High-Speed CMOS Logic Data DL129 -- Rev 6 1.0 85_C 0.33 3.84 0.1 0.1 4.4 5.4 0.8 0.8 2.0 2.0 40 25_C to 125_C
v
2.4
125_C
1.0
3.70
160
0.4
0.1 0.1
4.4 5.4
0.8 0.8
2.0 2.0
v
Unit
mA A A V V V V
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIII I III I I I I I I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIII I III I I I I I I I IIIIIIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I I I I III I II I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I I I III I I II I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II II I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I IIIIIIIIIII I I I III I I II II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII
* Used to determine the no-load dynamic power consumption: PD = CPD VCC 2 f + ICC VCC . For load considerations, see Chapter 2 of the Motorola High-Speed CMOS Data Book (DL129/D). NOTE: For propagation delays with loads other than 50 pF, and information on typical parametric values, see Chapter 2 of the Motorola High- Speed CMOS Data Book (DL129/D).
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII I III I I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII I III I I I IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIII III I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I I
AC ELECTRICAL CHARACTERISTICS (VCC = 5.0 V 10%, CL = 50 pF, Input tr = tf = 6.0 ns)
Symbol tPLH, tPHL tTLH, tTHL fMAX tPHL Cin Maximum Input Capacitance Maximum Output Transition Time, Any Output (Figures 1 and 4) Maximum Propagation Delay, Reset to Q (Figures 2 and 4) Maximum Propagation Delay, Clock to Q (Figures 1 and 4) Maximum Clock Frequency (50% Duty Cycle) Parameter - 55 to 25_C 10 15 23 24 30 Guaranteed Limit
High-Speed CMOS Logic Data DL129 -- Rev 6 Symbol tr, tf trec tsu CPD tw tw th Maximum Input Rise and Fall Times Minimum Pulse Width, Reset Minimum Pulse Width, Clock Minimum Recovery Time, Reset Inactive to Clock Minimum Hold Time, Clock to Data Minimum Setup Time, Data to Clock Parameter
TIMING REQUIREMENTS (VCC = 5.0 V 10%, CL = 50 pF, Input tr = tf = 6.0 ns)
Power Dissipation Capacitance (Per Enabled Output)*
3 Fig. 1 2 1 2 3 3 - 55 to 25_C Min 5.0 5.0 15 15 10 Max 500 Typical @ 25C, VCC = 5.0 V Guaranteed Limit Min 6.0 6.0 19 19 13
v 85_C
v 85_C
Max
500
10
19
28
30
24
79
Min
8.0
8.0
22
22
15
v 125_C
MC74HCT174A
v 125_C
10
22
35
36
20
Max
500
MOTOROLA MHz Unit Unit pF pF ns ns ns ns ns ns ns ns ns
MC74HCT174A
SWITCHING WAVEFORMS
tr 2.7 V 1.3 V 0.3 V tw 1/fmax tPLH Q 90% 1.3 V 10% tTLH tTHL tPHL Q tf VCC GND RESET tPHL 1.3 V trec CLOCK 1.3 V GND tw 1.3 V GND
CLOCK
3.0 V
3.0 V
Figure 1.
Figure 2.
TEST POINT VALID 3.0 V DATA 1.3 V GND tsu CLOCK th 3.0 V 1.3 V GND * Includes all probe and jig capacitance DEVICE UNDER TEST OUTPUT
CL*
Figure 3.
Figure 4. Test Circuit
EXPANDED LOGIC DIAGRAM
CLOCK D0 RESET 9 3 1 C D1 4 D R C D2 6 D Q R C D3 11 D R C D4 13 D R C D5 14 D Q R D C Q R 2
Q0
Q
5 Q1
7
Q2
Q
10
Q3
Q
12
Q4
15 Q5
MOTOROLA
4
High-Speed CMOS Logic Data DL129 -- Rev 6
MC74HCT174A
OUTLINE DIMENSIONS
N SUFFIX PLASTIC PACKAGE CASE 648-08 ISSUE R
B
1 8
-A -
16 9
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH. 5. ROUNDED CORNERS OPTIONAL. DIM A B C D F G H J K L M S INCHES MILLIMETERS MIN MAX MIN MAX 0.740 0.770 18.80 19.55 6.35 0.250 0.270 6.85 3.69 0.145 0.175 4.44 0.39 0.015 0.021 0.53 1.02 0.040 0.070 1.77 0.100 BSC 2.54 BSC 0.050 BSC 1.27 BSC 0.21 0.008 0.015 0.38 2.80 0.110 0.130 3.30 7.50 0.295 0.305 7.74 0 0 10 10 0.020 0.040 0.51 1.01
F S
C
L
-T - H G D 16 PL 0.25 (0.010)
M
SEATING PLANE
K
J TA
M
M
-A -
16 9
D SUFFIX PLASTIC SOIC PACKAGE CASE 751B-05 ISSUE J
-B -
1 8
P 8 PL 0.25 (0.010)
M
B
M
G F
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. DIM A B C D F G J K M P R MILLIMETERS MIN MAX 9.80 10.00 4.00 3.80 1.75 1.35 0.49 0.35 1.25 0.40 1.27 BSC 0.25 0.19 0.25 0.10 7 0 6.20 5.80 0.50 0.25 INCHES MIN MAX 0.386 0.393 0.150 0.157 0.054 0.068 0.014 0.019 0.016 0.049 0.050 BSC 0.008 0.009 0.004 0.009 0 7 0.229 0.244 0.010 0.019
K C -T SEATING -
PLANE
R X 45
M D 16 PL 0.25 (0.010)
M
J
T
B
S
A
S
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JAPAN: Nippon Motorola Ltd.; Tatsumi-SPD-JLDC, Toshikatsu Otsuki, 6F Seibu-Butsuryu-Center, 3-14-2 Tatsumi Koto-Ku, Tokyo 135, Japan. 03-3521-8315 HONG KONG: Motorola Semiconductors H.K. Ltd.; 8B Tai Ping Industrial Park, 51 Ting Kok Road, Tai Po, N.T., Hong Kong. 852-26629298
High-Speed CMOS Logic Data DL129 -- Rev 6
CODELINE
5
*MC74HCT174A/D*
MC74HCT174A/D MOTOROLA


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